Innovative encapsulants target microelectronic components
New Products
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By
eeNews Europe
The Delomonopox materials combine outstanding material properties such as chemical resistance, mechanical properties, excellent adhesion, optimized dispensing and flowing properties and variable curing parameters. According to the manufacturer, the new encapsulants enable production processes to be designed in a notably more flexible and efficient way. This helps users cut down production costs and boost output, while receiving the utmost product quality.
Visit DELO Industrial Adhesives at www.delo.de
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