INSIDE Secure partners with IDT for low-power USB security tokens

INSIDE Secure partners with IDT for low-power USB security tokens

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INSIDE Secure has collaborated with Integrated Device Technology to bring to market a compact, single-package secure microcontroller and oscillator solution that reduces the bill of materials when designing USB tokens for authentication and digital signatures.
By eeNews Europe


Available now in different package standards (SOIC8 or QFN20), the INSIDE/IDT offering combines the security, cryptography and connectivity features of the high-performance, low-power INSIDE Secure AT90SO72 secure microcontroller with the stability of the ultra-low power IDT 3MN11G CrystalFree CMOS oscillator to create the perfect solution for applications where low cost and reduced size are most critical.
The INSIDE AT90SO72 is based on a high-performance, low-power, 8/16-bit enhanced RISC CPU and is common criteria EAL5+ ready. It features a hardware random number generator, hardware AES (128-, 192- and 256-bit key supported), DES and triple DES. The AT90SO72 also includes the exclusive INSIDE Ad-X(TM)2 advanced hardware crypto accelerator, which supports RSA up to 4096 bits, DSA, Diffie-Hellman and all FIPS-recommended elliptic curves up to 1024 bits. Key generation is also supported for both RSA and Elliptic Curve Cryptography (ECC).
The AT90SO72 offers a USB 2.0 interface with six software-configurable data transfer endpoints with in-or-out (I/O) directions for bulk, interrupt or isochronous transfers. The flexible I/O options also include a master/slave Serial Peripheral Interface (SPI) controller, I2C (two-wire) controller, up to seven GPIO lines and an ISO 7816 interface. The AT90SO72 features 288K bytes of ROM and 72K bytes of high-density EEPROM (Electrically Erasable Programmable Read-Only Memory), which can be mapped as part of the program memory to provide a highly flexible and cost-effective solution for many applications.
The IDT 3MN-series belongs to a product family of ultra-low power monolithic CMOS ICs that replaces quartz crystal-based resonators and oscillators at the thinnest possible form factors without the use of any mechanical frequency source or Phase Locked Loop (PLL). The innovative devices empower system designers to integrate bare-dice into thin multi-die packages, or chip-on-board multi-die solutions. The IDT 3MN-series is optimized to work with USB 2.0 full/low speed and USB-InterChip (USB-IC) interface controller ICs, and high-density SIM and smart cards. It features a total frequency accuracy of 2,000 ppm over the industrial temperature range with an active-mode supply current of about two mA.

The INSIDE AT90SO72 is available now with the IDT 3MN11G oscillator in standard, RoHS-compliant SOIC-8 (5×5 mm) and QFN-20 (4×4 mm) packages.

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