Integrated 140A VRM for high power AI chips

Integrated 140A VRM for high power AI chips

New Products |
By Nick Flaherty

Flex Power Modules has launched a two-phase 140A power stage for Voltage Regulator Module (VRM) designs with bottom cooling for high power AI chips, GPUs and FPGAs.

The BMR511 has a footprint of 0.9 cm2/0.14 in2 and a height of 8 mm/0.31 in to fit alongside AI chips on server boards and is available with LGA or solder-bump terminations to provided local power conversion with a peak current of 140A. The power stage is optimized for bottom-side cooling to complement the previous BMR510 which is optimized for top-side cooling.

The BMR511 operates over a 5 -15 V input range and delivers an adjustable 0.5 – 1.8 V output, set by a user-defined external controller via tri-state PWM inputs. Each device can supply a current of 80 A continuous total and 140 A peak, at high efficiency peaking at 94.5%, while parts can be directly paralleled for even higher current outputs. The input voltage range makes the BMR511 compatible with several unregulated front-end Intermediate Bus Converters which operate with typical input to output ratios of 3:1 up to 7:1.

The two power stage phases can be separately enabled and disabled and the part provides feedback to an external controller of device temperature and the individual phase currents supplied to the AI chips.

The operating temperature range of the BMR511 is -40°C to 125°C on a defined reference point and Flex Power Modules provides comprehensive thermal derating data for a range of airflow rates and cold plate/host board temperatures. Fault reporting and over-current protection is included.

 “The BMR511 is ideal as a VRM power stage for AI applications,” said David Xie, Director R&D and Product Management, China of Flex Power Modules. “The tiny form factor and high peak power rating perfectly match the power rail requirements of modern CPUs, GPUs, IPUs and high-performance ASICs.”

The BMR511 is now available for sampling as well as for volume production.




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