Integrated MEMS accelerometer/gyro for auto safety/ADAS

Integrated MEMS accelerometer/gyro for auto safety/ADAS

New Products |
By Graham Prophet

Minimizing large error sources is essential for designing more reliable and accurate automotive safety systems, such as robust Electronic Stability Control (ESC) and rollover detection. These build on traditional chassis control systems already in the vehicle, including the anti-lock braking system, traction control, and yaw control. Current ESC and rollover detection system designs, ADI says, often involve two or more discrete accelerometers and gyroscopes, which offer less shock and vibration immunity while costing more and requiring more board space. The ADXC150x combo sensor family overcomes the challenges associated with integrating an automotive-grade gyroscope and accelerometer in a single package, combining up to 4 degrees of freedom (DOF) into a single device, which not only reduces component count and expensive, time-consuming custom integration, but also improves inertial sensing accuracy and reliability. Yaw gyro drift over temperature is less than 1 deg/sec (typical) and the internal temperature sensor calibrates the output to provide stability across the whole automotive temperature range (−40C to 105C).


ADXC150x also features comprehensive electromechanical fail-safe routines and continuously monitors device health to ensure the integrity of the data. The ADXC150x gyroscope employs ADI’s differential Quad-Sensor design that rejects linear acceleration, including external g-forces and vibration. The accelerometer features a low-Q sensor beam design with exceptional noise rejection performance and a wide dynamic range enabling robust overload signal handling in the most challenging automotive environments. Two configurations are initially available: the ADXC1500, which features a dual-axis accelerometer with yaw rate gyro, and the ADXC1501, which features a three-axis accelerometer with yaw rate gyro. Both offer SPI digital output and are available in a 16-lead inverted cavity SOIC package for EMI performance.


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