Integrated power management IC cuts BOM, space
The chip is optimized as a companion PMIC for ST’s STM32MP1 heterogeneous multicore microprocessors, which target a broad range of applications by integrating single or dual Arm Cortex-A7 and Cortex-M4 cores, an optional 3D graphics processing unit, and rich digital and analog peripherals.
More than simply saving board space and BOM cost, compared to arranging the same number of power rails using discrete components, the STPMIC1 also provides power-rail monitoring and protection, handles power-up/down sequencing, and meets the ST32MP1 accuracy and settling-time specifications. ST Authorized Partner Octavo Systems has utilized the STM32MP1 and STPMIC1 to create the OSD32MP1x family of microprocessor system-in-package (SiP) devices, which occupy a footprint up to 64% smaller than an equivalent system implemented with discrete components while also addressing engineering challenges such as power sequencing.
In addition to supplying power rails for the microprocessor unit (MPU) and external system components, the STPMIC1 also provides a DDR memory reference voltage, a 500mA USB OTG power switch, and a general-purpose power switch. An I2C interface and additional pins allow the MPU to manage the PMIC.
The four buck converters in the PMIC are designed for fast transient response and precise output-voltage control to handle a wide range of operating conditions. A pulse-frequency modulation mode boosts energy efficiency at low loads. During normal operation, pulse-width modulation (PWM) synchronization minimizes electro-magnetic interference (EMI). The boost converter, with bypass-mode capability, can power up to two USB ports and ensures smooth regulation either when operating from a battery or low-cost 5V AC/DC adapter. The STPMIC1 is in production now and available in a 5x6x0.8mm WFQFN 44-lead package.
STMicroelectronics – www.st.com
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
