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Integrated power modules reduce component count, shrink PCB size up to 70 percent and simplify class D amplifier design

Integrated power modules reduce component count, shrink PCB size up to 70 percent and simplify class D amplifier design

New Products |
By eeNews Europe



The new devices integrate a PWM controller and two digital audio power MOSFETs in a single package to offer a highly efficient, compact solution that reduces component count, shrinks PCB size up to 70 percent and simplifies Class D amplifier design.

The combination of an advanced audio controller IC with MOSFETs fully optimized for audio performance results in improved efficiency, THD, and EMI, allowing the IR43xxM family operate without a mechanical heatsink over a wide power supply range on either a single or split power supply. High voltage ratings and noise immunity ensure reliable operation over various environmental conditions.

The single channel IR4301M and dual channel IR4302M offer the flexibility and convenience of building stereo amplifier and multi-channel designs in various channel configurations, while the devices’ 5×6 mm and 7×7 mm PQFN packages enhance the benefit of utilizing a smaller size of Class D topology.

Other key features common to the family include over-current protection, thermal shutdown, internal/external shutdown and floating differential input. The IR4302M also offers clip detection.

A wide range of reference designs are available to further simplify the design of systems using these devices.

Pricing for the IR43xx begins at US $2.00 in 10,000-unit quantities. Pricing is subject to change without notice. Production orders are available immediately. The new devices are MSL2 industrial-qualified and RoHS compliant.

Visit International Rectifier at www.irf.com

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