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Intel backs Samsung’s novel DRAM module form factor

Intel backs Samsung’s novel DRAM module form factor

Technology News |
By Peter Clarke

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Memory chip market leader Samsung Electronics has received support from Intel for its Low Power Compression Attached Memory Module (LPCAMM) form factor for DRAMs.

The company claims the LPCAMM – expected to come to market in 2024 – will change how DRAMs are deployed within personal computers and laptop computers – and potentially into servers and data centers as well.

The LPCAMM is printed circuit board (PCB) form factor that supports multiple low-power double data rate (LPDDR) DRAMs and provides a data transmission bandwidth to the motherboard of 7.5Gbits-per-second. The first examples of the LPCAMM from Samsung have completed system verification by use within Intel-based PC platforms, Samsung said.

At present PCs and laptop computers conventionally use either LPDDR DRAM soldered on to the mother board or DDR-based small-outline dual-in-line memory modules (SO-DIMMs) housed in sockets.

LPDDR DRAMs are compact but are permanently attached to the motherboard, making it challenging to replace during repairs or upgrades. SO-DIMMs can be attached or detached easily but have limitations with performance and how much motherboard real-estate they occupy, said Samsung.

Best of both

The LPCAMM formfactor provides the best of both predecessor solutions, claims Samsung.

The LPCAMM is detachable providing flexibility for PC manufacturers but with its T-shape occupies up to 60 percent less space on the motherboard. Samsung claims the use of LPCAMM can improve computer performance by up to 50 percent and power efficiency by up to 70 percent.

“The energy efficiency and repairability advantages of LPCAMM make this new form factor a game changer in today’s PC market,” said Dimitrios Ziakas, vice president of memory & IO technology at Intel, in a statement issued by Samsung.

“Samsung is committed to actively pursuing opportunities to expand the LPCAMM solution market and collaborating closely with the industry to explore new applications for its use,” said Yongcheol Bae, executive vice president responsible for the memory product planning team at Samsung, in the same statement.

LPCAMM is set to be tested using next-generation systems with potential customers during 2023, and commercialization is planned for 2024.

Related links and articles:

www.samsung.com

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