Intel Foundry Services (IFS) has launched the next phase of its Accelerator ecosystem program with an alliance for cloud-based design tools.
The IFS Cloud Alliance will enable secure design environments in the cloud, which is one of the key barriers to using the technology. This will help to improve the design efficiency of customers for its fledgling foundry business by providing easily scalable compute performance.
Initial members of the program include leading cloud providers Amazon Web Services and Microsoft Azure, as well as key EDA suppliers Ansys, Cadence, Siemens EDA and Synopsys.
“The IFS Cloud Alliance will enable broader access to Intel’s advanced process and packaging technologies,” said Randhir Thakur, president of Intel Foundry Services. “Our partnerships with leading cloud providers and EDA tool suppliers will provide a flexible and secure platform where customers can scale compute requirements instantly on production-proven design environments in the cloud,”
Advances in EDA tools and cloud technologies can deliver security and IP confidentiality, while simultaneously shortening design cycles and accelerating time-to-market for designers, says the company.
“Chip design is moving to the cloud at lightning speed. The Intel Foundry Services Cloud Alliance program will further accelerate the semiconductor industry’s adoption of cloud-based design, ensuring that engineers can continue to use the best technology, tools and flows as they move design to the cloud. We are collaborating with IFS as part of the Cloud Alliance, to enable our mutual customers to deploy our tools quickly and efficiently on the public cloud and help them deliver better products faster while meeting increasingly complex design and verification challenges,” said Sandeep Mehndiratta, vice president, Enterprise Go-To-Market & Cloud at Synopsys.
Through the Cloud Alliance, IFS will collaborate with partners to ensure that EDA tools are optimized to take advantage of the scalability of the cloud while meeting the requirements of Intel’s process design kits (PDKs).
This will provide customers a secure and scalable path to adopt their preferred EDA tools and flows in the cloud environment using on-demand hardware. This will allow chip designers to tackle larger workloads with better resource management, time-to-market and result quality.
“Ansys’ comprehensive suite of interoperable, scalable multiphysics solutions plays a key role in IFS’ first design flow supported in the cloud. We look forward to continuing our long-standing collaboration with Intel to advance semiconductor design by ensuring that chip designers can access Ansys’ gold standard multiphysics solution via the cloud regardless of their chosen EDA workflow,” said John Lee, vice president and general manager of the Semiconductor, Electronics, and Optics Business Unit at Ansys
“By joining the Intel Foundry Services Cloud Alliance, we’re enabling our mutual customers to leverage the scalable compute power of the cloud with our production-proven portfolio along with Intel’s advanced process and packaging technologies in a secure design environment,” said Mahesh Turaga, vice president, Cloud Business Development at Cadence.
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