Intel is catching up with chip manufacturing technology leader TSMC, according to Scotten Jones who has provided a review of a recent paper on the ‘Intel 4’ manufacturing process in SemiWiki.
Intel presented the process at the VLSI Technology Symposium held recently in a paper titled: “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors optimized for High Density and High-Performance Computing.”
Jones reported that Meteor Lake processors have been produced in the process and that it is ready for production in the 2H23.
Intel to lead at 3nm?
In terms of density and performance Intel 4 sits between TSMC’s N5 and N3.
Jones commented: “If Intel continues on-track and releases Intel 3 next year they will have a foundry process that is competitive on density and possibly the leader on performance.” He added: “Samsung and TSMC are both due to introduce 2nm processes in the 2024/2025 time frame and they will need to provide significant improvement over their 3nm processes to keep pace with Intel.”
However, it is also notable that TSMC is apparently building 3nm manufacturing capacity predicated on Intel demand as a foundry customer.
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