Intel is close to announcing a plant to assemble 25 and 3D packages in Italy, according to a report from Reuters.
The investment could be as much as $5bn although this would not require leading edge chip making equipment. The search has been narrowed to two northern regions in Piedmont or Veneto, say multiple sources quoted in the report. Intel had previously said it was looking a plant in Italy as well as France.
The plant is expected to use Intel’s Foveros assembly technology that mounts chiplets or tiles on a die or substrate in a 2.5D or 3D process. This has already been used for the Ponte Vecchio GPU.
The deal is expected to be funded by the Italian government and the European Commission under the EU CHIPS Act. This could be as much as 40% of the funding, say sources. The Italian government has allocated €4bn until 2030 to attract semiconductor projects.
Intel is in the process of acquiring Tower Semiconductor which has a deal to share the wafer fab at Agrate, Italy being built by STMicroelectronics. ST is also building a second 300mm fab at Crolles, France, in partnership with GlobalFoundries.
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