Intel looks to 14A process in 2026
Intel is looking to have its 1.4nm 14A process technology available in 2026 following mass production of its 18A process.
Intel Foundry unveiled a new roadmap with the 14A process technology, specialized node evolutions and new Intel Foundry Advanced System Assembly and Test (ASAT) capabilities for custom AI chips and chiplets.
Intel says the 18A process will start production by the end of 2024, and Microsoft has chosen a chip design it plans to produce on the process.
Synopsys, Cadence, Siemens and Ansys have announced tools, design flows and intellectual property (IP) portfolios ready to enable customer designs, while ARM has launched two new Compute SubSystems (CSS) for high performance AI chips. Microsoft used the previous family of CSS for its Cobalt chip.
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Intel is also working with ARM on an “Emerging Business Initiative” providing essential IP, manufacturing support and financial assistance for custom system-on-chip (SoC) designs by startups. Intel’s systems foundry approach offers full-stack optimization from the factory network to software.
The 14A process is new to the Intel roadmap, using EUV lithography with a high numerical aperture (High-NA) with backside power via connections and the same RibbonFET devices as 18A. An extended version with more features, 14A-E is planned for 2027.
This is alongside a new version of the 3nm process called Intel 3-T. This is optimized with through-silicon vias for 3D advanced packaging designs and will soon reach manufacturing readiness.
Intel Foundry plans a new node every two years and node evolutions along the way, after launching five processes in four years in a bid to catch up with TSMC and Samsung. TSMC plans to have initial production of 2nm chips using gate all around (GAA) transistors that are equivalent to the Intel RibbonFET devices, by the end of the year. Samsung is also planning to optimise ARM’s Cortex-X cores for its 2nm GAA process for system-on-chip designs.
- ARM edges closer to full 2nm chip designs with Total Design
- ARM V3, N3 CSS for custom chip and chiplet designs
- Cadence, Intel Foundry collaborate on advanced packaging
Intel also announced the addition of Intel Foundry FCBGA 2D+ packaging to its ASAT offerings, which already include FCBGA 2D, EMIB, Foveros and Foveros Direct stacked and chiplet packaging that it uses for its latest processors. At the same time, several vendors announced plans to collaborate on assembly technology and design flows for Intel’s embedded multi-die interconnect bridge (EMIB) 2.5D packaging technology.
This includes Cadence (above) and Siemens, with a reference flow that includes Xpedition Substrate Integrator software, Xpedition Package Designer software, Hyperlynx software SI/PI and the Calibre nmPlatform tool including Calibre 3DSTACK software. This is used to tackle a range of critical tasks including early package assembly prototyping, hierarchical device floorplanning, co-design optimization, verification of the complete detailed implementation, including signal and power integrity analysis, and Package Assembly Design Kit (PADK) driven assembly verification.
“Siemens is pleased to collaborate with Intel Foundry to develop and deliver a certified reference flow for Intel’s innovative EMIB technology,” said AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software. “As a longtime supplier to Intel, Siemens is honored to be chosen for this project and looks forward to sharing our 3D-IC expertise for the benefit of our mutual customers.”
“AI is profoundly transforming the world and how we think about technology and the silicon that powers it,” said Pat Gelsinger, CEO of Intel. “This is creating an unprecedented opportunity for the world’s most innovative chip designers and for Intel Foundry, the world’s first systems foundry for the AI era. Together, we can create new markets and revolutionize how the world uses technology to improve people’s lives.”
“We are in the midst of a very exciting platform shift that will fundamentally transform productivity for every individual organization and the entire industry,” said Satya Nadella, CEO of Microsoft. “To achieve this vision, we need a reliable supply of the most advanced, high-performance and high-quality semiconductors. That’s why we are so excited to work with Intel Foundry, and why we have chosen a chip design that we plan to produce on Intel 18A process.”
The company says it is committed to achieving 100% use of renewable electricity worldwide, net-positive water and zero waste to landfills by 2030. Intel also reinforced its commitment to net-zero Scope 1 and Scope 2 green house gas emissions by 2040 and net-zero upstream Scope 3 emissions from suppliers by 2050.
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