Intel signs Siemens for digital twin fab digitalisation
Intel has signed a memorandum of understanding (MoU) with Siemens to collaborate on digitalization of its wafer fabs using digital twin technology.
Siemens and Intel will work on evolving factory operations and cybersecurity, and supporting a resilient global industry ecosystem.
The MoU identifies key areas of collaboration to explore a variety of initiatives, including optimizing energy management and addressing carbon footprints across the value chain. For instance, the collaboration will explore use of digital twins of complex, highly capital-intensive manufacturing facilities to standardize solutions where every percentage of efficiency gained is meaningful.
STMIcroelectronics for example is already using digital twin versions of its equipment and fab at Crolles in France to monitor and optimise the performance of the equipment.
- ST builds digital twin of Crolles fab
- Mitsubishi boosts factory automation production with digital twin
- AI boost for more accurate digital twin development
“Semiconductors are the lifeblood of our modern economies. Few things run without chips. Therefore, we’re proud to collaborate with Intel to quickly advance semiconductor production. Siemens will bring its entire cutting-edge portfolio of IoT-enabled hardware and software and electrical equipment to this collaboration,” said Cedrik Neike, CEO of Digital Industries and member of the Managing Board of Siemens. “Our joint efforts will contribute to achieving global sustainability goals.”
The Siemens collaboration will also explore minimizing energy use through advanced modeling of natural resources and environmental footprints. To gain more information on product-related emissions, Intel will explore product- and supply chain-related modeling solutions with Siemens that drive data-based insights and help the industry accelerate progress in reducing its collective footprint.
Siemens has already worked with multiple battery manufacturers to develop digital twin systems to optimise the battery-making process for more sustainable production and is regularly adding AI optimisation tools to its Xcelerator software platform.
- Gotion ships first German battery, signs Siemens for digital twin
- Siemens digital twins for ACC battery gigafactories
- First exchangeable digital twin boosts industrial automation
“The world needs a more globally balanced, sustainable and resilient semiconductor supply chain to meet the increasing demand for chips,” said Keyvan Esfarjani, executive vice president and chief global operations officer at Intel. “We are excited to build upon Intel’s advanced manufacturing capabilities by expanding our collaboration with Siemens to explore new areas where we can utilize Siemens’ portfolio of automation solutions to enhance efficiency and sustainability in semiconductor infrastructure, facilities and factory operations. This MoU will benefit regional and global industry value chains.”
www.siemens.com; www.intel.com
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
