International Semiconductor Alliance launches for European chip packaging
Four European companies have launched the International Semiconductor Alliance to provide a single source for chip packaging and assembly.
Tresky GmbH, budatec GmbH, Berliner Nanotest und Design GmbH and Bond Pulse launched the International Semiconductor Alliance at the Productronica 2023 exhibition in Munich last week to help customers with the selection, project planning and implementation of chip packaging from a single source.
“Very often, all four of us noticed that we were not only in contact with the same customers, but were also often involved in the same projects. In order to offer our joint customers even better services, we decided to take the step of working together as closely as possible,” said Daniel Schultze, Managing Director of Tresky and one of the initiators of the Alliance.
The ISA founding companies offer the implementation of all sub-processes in packaging technology. Interested companies can obtain all processes in the manufacturing chain from the members of the ISA from a single source, from bonding, soldering and sintering to inspection and quality analysis.
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In addition, cross-process support and consulting services are offered for an efficient, reliable and reproducible manufacturing process. “Our customers and interested parties can thus rely on a holistic manufacturing concept that not only massively reduces implementation costs, but also time-to-market,” says Dirk Buße, Managing Director of budatec. With Dr. Aaron Hutzler, a well-known process specialist in the industry, the Alliance has an expert with cross-process know-how, which is particularly valuable in the evaluation and assessment of work steps.
Various services can be obtained from ISA, including feasibility studies for chip packaging in joint application laboratories. These laboratory facilities are also used to produce small series and prototypes on behalf of customers.
“Of course, we advise our customers and pass on our knowledge to them. This involves a holistic evaluation of your assembly and connection technologies. We work with our customers to determine the ideal manufacturing processes and parameters for producing your end products,” said Dr. Mohamad Abo Ras, managing director of Berlin-based Nanotest und Design. Based on the end product, the production volume and the specified cost framework, ISA’s specialists draw up recommendations for process developments as well as structural and process optimizations. The evaluations ultimately shorten the time-to-market.
“One of the most important parts, however, is the management of joint projects. Once we and our customers know how we manufacture their products, we support them in the holistic project planning and design of the manufacturing process. This means they get the manufacturing systems as well as the know-how and processes from a single source, which significantly reduces the overall effort on the customer side,” said Schultze.
The Alliance members say they are open to other companies as well as customers and interested parties. “Other companies can also join our Alliance. The Productronica trade fair in Munich was a good opportunity to do so, as we can provide interested companies with further information about a possible collaboration,” said Alexander Dahlbüdding, Managing Director of budatec.
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