Isolated DC-DC converters deliver power density benefits for industrial and military applications
Combining isolation, voltage transformation and output regulation in a form factor less than half the size of a conventional isolated 1/16th brick and available in a wide 28 V military input voltage range (16 V to 50 V) or narrow range 24 V industrial input range (18 V to 36 V), the Cool-Power PI3106 is ideally suited for ultra-compact system designs where power conversion density is critical.
The Cool-Power PI3106 expands the existing Cool-Power portfolio from 48 V communication applications to 24 V industrial and 28 V military applications.
The Cool-Power PI3106 utilizes advanced Zero Voltage Switching (ZVS) architecture and control, state of the art planar magnetics, and ultra-high density Power System in Package (PSiP) packaging. The combination of these technologies enables a complete isolated DC-DC power solution within a high density encapsulated IC-like surface mount package. This high density packaging platform facilitates PCB layout optimization, offers the designer the opportunity to employ a variety of cooling techniques and protects the circuit components against mechanical and ambient factors, thus improving reliability.
The PI3106 reduces board area consumption by 50% compared to conventional designs, allowing for power conversion closer to the point-of-load, thereby enabling smaller form factors and higher efficiencies. The high switching frequency (900 kHz) of the PI3106 reduces input filter and output capacitance requirements, further minimizing space and cost constraints.
The conversion architecture, high performance silicon integration, advanced packaging and planar magnetics at the heart of the Cool-Power solution enable a true step-function improvement in power conversion density. Vicor continues to expand the Picor Cool-Power portfolio for different markets and applications and plans to extend the offering of high density point-of-load regulators in the near future applying the company’s core strengths in high performance power management, silicon integration and system-level packaging.
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