Italian EDA startup offers IC, package co-design tool
Genio supports the design of 2D, 2.5D and 3D multi-component systems and operates across multiple levels including die, chiplet, silicon interposer, package and PCB. Indeed the tool comes in three flavors supporting 2D, 2.5D and 3D design.
It has been said that a lack of support for 3D design by the leading EDA companies over the last 20 years has contributed to its slow development so the arrival of
Monozukuri was founded in 2014 by a team of EDA IC and package co-design engineers with the intention of building 3D EDA technology from scratch that can deal with the I/O planning and optimization phase of physical implementation of complex 2.5D and 3D ICs. The tool includes floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimization.
The company’s founder and CEO is Anna Fontanelli.
The Genio tool suite uses standard design data formats to integrate with existing commercial EDA tools and allows dedicated plug-insto integrate into non-standard custom EDA flows. It has a graphic interface that provides an interactive 3D visualization of the complete system.
Related links and articles:
News articles:
EV Group, ASM partner for 3D-IC, chiplet bonding
Synopsys launches 3D design compiler
TSMC preps for ‘chiplet’ style manufacturing in 2021
Imec, SPTS developing key tool for 3D chips
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
