Japan is going to subsidize Micron Technology Inc. (Boise, Idaho) with up to 46.6 billion yen (about US$320 million) to make memory chips in Horishima, according to reports.
The reports quote Japan’s Economy and Trade Minister Yasutoshi Nishimura who made an announcement shortly after meeting with US Vice President Kamala Harris. The two politicians discussed stepping up cooperation between their two companies on manufacturing and supply chains.
“I hope the deal will contribute to further expansion of cooperation between Japan and the United States in the area of semiconductors,” the reports quoted Nishimura saying. The deal was set up under a law related to economic security.
Micron said it would use the funds to speed up development of 1-beta DRAM and memory for artificial intelligence.
Japan has also allocated 476 billion yen ($3.3 billion) in subsidies to TSMC and Sony for the construction of a wafer fab in the southern prefecture of Kumamoto (see Japan to provide 40% subsidy to TSMC, Sony venture). In a third deal Japan is providing up to 92.9 billion yen ($640 million) to a facility in Mie prefecture jointly built by Western Digital Corp. and Kioxia Corp.
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