Key power research programme comes to an end

Key power research programme comes to an end

Business news |
By Nick Flaherty

Over the past three years, 26 companies and institutions across Europe have been working on the €55m eRamp project developing new production technologies for power devices built on 300mm silicon wafers.

“Europe and Germany are distinguished by their characteristic knowledge and expertise,” said Dr Reinhard Ploss, CEO of Infineon Technologies. “The partners in eRamp have the entire power electronics value creation chain in mind, from generation and transmission all the way to consumption of electric energy.”

eRamp has been looking at More than Moore (MtM) technologies such as 3D stacking, interconnect and packaging. “The eRamp results have created the prerequisites for keeping the production of power electronics in Europe competitive,” said Dr Oliver Pyper, Senior Manager of Research, Development and Innovation Programs at Infineon Technologies Dresden and the eRamp project coordinator. “Power electronics guarantee an ever more efficient generation, transmission, and use of electric energy. It is in this area that eRamp has significantly expanded our expertise in Europe.”

The research partners used existing pilot lines and production expertise at five European sites:

  • Dresden, Germany and Villach, Austria (power semiconductors based on 300mm wafers; Infineon)
  • Regensburg, Germany (chip packaging technologies for power semiconductors; Infineon)
  • Reutlingen, Germany (power semiconductors, smart power and sensors based on 200mm wafers; Bosch)
  • Unterpremstaetten near Graz, Austria (3D/TSV pilot line; ams)

In addition, Infineon, Osram, and Siemens worked together to construct testing equipment and demonstrators for the evaluation of a new chip embedding technology.

The project was backed by the European ENIAC Joint Undertaking, as well as by the German Federal Ministry of Education and Research, the largest national sponsor. Financial support also came from Austria, the Netherlands, Romania, Slovakia, and the UK.

eRamp was one project working on power electronics on 300mm wafers, alongside EPT300, EPPL and PowerBase. In the four projects, over 100 partners are working on power technologies.

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