Kioxia announces another 3D-NAND wafer fab

Kioxia announces another 3D-NAND wafer fab

Business news |
By Peter Clarke

The 136,000 square meter area adjacent to the current site will provide room for the construction of the company’s ‘K2’ manufacturing facility, with site preparation work due to commence in spring of 2021 and to be completed by spring of 2022.

Kioxia did not disclose how much it plans to spend on the K2 wafer fab or how soon it would be producing 3D-NAND flash memory chips.

The latest announcement comes after Kioxia announced it would begin constructing a $9.5 billion wafer fab at its Yokkaichi site in Mie Prefecture beginning in spring 2021 (see Kioxia announces next 3D-NAND wafer fab, delays IPO).

Although Kioxia recently announced it had delayed plans for an IPO it is reported that it has gained a license from the US government to supply memories for servers to the sanction-bound Chinese company Huawei Technologies Inc.

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Kioxia announces next 3D-NAND wafer fab, delays IPO

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Samsung to expand NAND flash production

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