Korea’s BOS to develop ADAS chip system for European OEM
BOS Semiconductor Ltd. (Seoul, South Korea) has signed a contract to co-develop a flexible ADAS chiplet-based SoC system for a European OEM’s next-generation automotive system.
The contract includes the use of BOS’s Eagle-N AI accelerator and Eagle-A SoC in the chiplet system configuration using a high-speed UCIe interface. The partnership will cover architectural design of the SoC through to vehicle system validation and AI software optimization.
BOS was founded in 2022 as an automotive fabless semiconductor company by Jaehong Park, a former Samsung Semiconductor executive vice president.
“We believe that our Eagle SoC family will offer a compelling alternative choice in the automotive industry, providing a full range SoC portfolio covering low-end, mid-range and high-end ADAS applications,” said Park, in a statement.
The Eagle-N, the first product in the Eagle ADAS SoC range, provides 250TOPS of AI acceleration with multiple PCIe interfaces. Evaluation samples are due in April 2025 with mass production due in 2026.
Eagle-A is a stand-alone SoC that supports camera, lidar, radar fusion and complex CPU/GPU workloads alongside an AI NPU accelerator and PCIe Gen5/UCIe interfaces. Samples are due in 1Q27 with mass production to follow in 2028.
Making use of the IP already developed for Eagle-N and Eagle-A, BOS will develop an ADAS chiplet platform using one, two, or three Eagle-N die and one Eagle-A die. This approach is expected to provide a flexible, configurable system capable of supporting Level 2, 3 and Level 4 autonomous driving vehicles.
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