Kulicke ships first Fluxless Thermo-Compression Bonder for chiplet assembly
Kulicke and Soffa Industries has shipped its first Fluxless Thermo-Compression Bonder (TCB) to a key customer.
Increased packaging complexity of high-volume general semiconductors is rapidly increasing demand for advanced semiconductor assembly equipment. Heterogeneous Integration (HI), otherwise known as chiplets, and System-in-Package (SiP) for emerging logic, processor, mixed-signal, silicon photonics, and sensing applications needs new assembly technologies.
The fluxless TCB approach eliminates contamination concerns while ensuring interconnect integrity through a unique and integrated fluxless delivery module. This supports the majority of emerging heterogeneous packaging needs down to 10µm.
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According to market researchers Techinsights, the global TCB market is expected to grow at a 17.1% CAGR. K&S expects its thermo-compression business to grow by nearly 5 times this year.
“TCB remains the most cost-effective micro-bump solution for the fine-pitch interconnect process. K&S’s unique fluxless bonding brings strong product differentiation value for the Thermo-Compression process. With our extensive development efforts, innovations and engagements with several customers, we are well positioned to rapidly support the emerging industry needs for leading-edge logic production,” said Chan Pin Chong, K&S’s Executive Vice President of Products and Solutions.
In addition to Fluxless Thermo-Compression, the company’s semiconductor advanced packaging portfolio and development initiatives also address wafer-level packaging, SiP, high accuracy flip chip, lithography and hybrid bonding applications.
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