Laird’s thermoelectric assembly product line now available from Digi-Key
Starting with a standard TEA platform in the initial design stage enables customers’ end products to reach the market faster and lowers the product development cost of designing a thermal management solution. The module examines standard heat transfer mechanisms that use convection, conduction or liquid to absorb and dissipate heat generated in a system. It also explains the various ways the mechanisms can be configured in a TEA. Selection of proper heat exchangers is critical to assure sufficient heat is removed from electronics that are sensitive to high temperatures or temperature swings. Removal of waste heat extends the life of electronics and lowers field maintenance costs by reducing downtime. The module also highlights how TEAs are used in various applications.
More information about Thermal Management Solutions from Laird Technologies
Visit Digi-Key at www.digikey.com
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
