Large body FCBGA substrate for data centers

Large body FCBGA substrate for data centers

New Products |
By Jean-Pierre Joosting

Daeduck Electronics announced the successful development of a large body FCBGA (Flip-chip Ball Grid Array) substrate for AI servers and data centers.

FCBGA is a high-density semiconductor substrate that connects semiconductor chips and package substrates using the flip-chip method and improves electrical and thermal characteristics.

The large body FCBGA substrate is state-of-the-art with a size of 100- x 100-mm, with 20 or more layers, and is applied to high-performance computing (HPC) chips, which are commonly known as data center chips. It can also be applied to CPUs, GPUs, and 2.5D packages known as CoWoS (Chip on Wafer on Substrate) packaging used in AI servers. In fact, the substrate has the technological capabilities for all FCBGA applications.

In addition, the company is preparing for another challenge in the next-generation packaging market by developing a technology that integrates silicon capacitor embedding technology, bridge integration technology, and large body FCBGA substrate technology.

“As semiconductor technology advances rapidly, we will focus on expanding our market share in next-generation markets such as AI and autonomous driving through collaboration with global major companies based on our differentiated cutting-edge technology,” said Young-Joo KO, CTO Daeduck Electronics.

Established in 1965, Daeduck Electronics holds the distinction of being Korea’s pioneering mass-producer of PCBs, thus contributing significantly to the advancement of the nation’s electronics sector for over six decades. With operations spanning five strategic locations, including four in Korea and one in Vietnam, coupled with its presence in key international markets through sales offices in the United States, China, and Taiwan, the company is poised for dynamic growth in tandem with the global package substrate market.

In recent years, Daeduck Electronics has strategically realigned its focus towards Semiconductor Package Substrates, marking a decisive entry into the FCBGA market through comprehensive investments commencing in 2021. This strategic movement has positioning Daeduck Electronics as Korea’s premier FCBGA manufacturer, underscored by tangible achievements and visible market impact.

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