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Laser process enables innovative LED designs

Laser process enables innovative LED designs

Technology News |
By eeNews Europe



Adding strip conductors to three-dimensional plastic bodies – this is the domain of the Laser Direct Structuring technology (LDS). The technology enables passive component to take over electronic functions. Components manufactured with LDS can be found in more than half of the smartphones available today. The advantages are obvious: The LDS components are much smaller and lighter than their conventional counterparts. They also can be quickly adapted to new requirements and help reducing the need for separate components.

With LDS components, two important requirements for LED lighting are met. LED lights achieve a 3-D directional characteristic and using heat-conducting plastics as the carrier material solves the temperature problem.

At the upcoming 3rd International LED professional Symposium (LpS 2013) in Bregenz, LPKF Laser and Electronics AG will present an innovation: A metallic carrier is coated with a specific powder capable of responding to laser radiation; after the laser structuring process, metallic conductors can be added on the surface. This technology opens new application perspectives: metallic bodies of any shape can be transformed into carriers for LEDs and at the same time also act as heat sink.

At the LpS, LPKF will demonstrate the process, the materials and the equipment required for automatic placement. The presentation will be held by experts from LPKF, placement machine builder Essemtec and others.

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