
The chip’s ability to scale to support higher power applications up to 120W by wiring products in parallel is a critical feature. This reduces the number of different ICs that manufacturers need to keep in inventory. Using the FL77944, designers can eliminate the need for electrolytic caps, transformers and inductance coils. This reduces both the bill-of-materials (BOM) costs and the overall complexity compared to designs using SMPS, also reducing board space since the controller IC can be placed on the same PCBs as the LEDs. The FL77944 is available now, as well as the FEBFL77944 evaluation board.
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