LED in flip-chip die offers more flexibility for luminaire designers
With the availability of LEDs implemented in flip chip technology, luminaire manufacturers have the choice between conventional wire bonding and the flip chip technology and thus they can enjoy the best of both worlds, said Philips Lumileds CEO Pierre-Yves Lesaicherre. "They can either incorporate packaged LEDs as they did in the past, or start with the LED die and customize the phosphor and packaging to best suit their lighting application", he said.
While traditional wire bonding limits the packing and power density of LEDs, LUXEON Flip Chip LEDs can be packaged closer and can be driven at a higher current density. This requires fewer emitters to achieve a higher lumen output at higher lumen densities, a capability that is especially advantageous with chip-on-board and other high-power applications. The usage of flip chip devices translates into higher lumens per dollar through higher lumen densities and a straightforward packaging process, Lesaicherre said.
Philips Lumileds introduced high-power LUXEON Flip Chips in a 1.0 mm x 1.0 mm format at the Strategies in Light trade fair in San Jose, California. These chips take advantage of the same epitaxial technology, materials and design as do other LUXEON LEDs, the company said.
For more information visit www.philipslumileds.com
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