Alcatel-Lucent Bell Labs, Thales and CEA-Leti said they are combining their expertise in III-V semiconductors and silicon technologies to open opportunities for innovation. The enlarged partnership will target applications in telecoms, industrial control, environmental testing, defense, security and space.
Thereafter, three research goals are defined covering (1) the integration of the incomparable speed, power and optical capabilities of III-V components on silicon CMOS integrated circuits; (2) the development of smarter, smaller components with innovative features by heterogeneously integrating active III-V components (optical, microwave, high-power components) with silicon circuits and Microsystems; (3) as well as the production of III-V components on silicon substrates and in silicon microelectronic manufacturing lines to reduce costs.
Partners said the III-V Lab will focus on practical applications for the combined potential of semiconductor and silicon. Four areas of research and markets will be favored.
First, researchers will work on integrated photonic circuits that combine the active and passive functions of III-V and silicon for high-speed telecommunications and data transfer. The second focus is high-power and microwave GaN-based microelectronics to increase the power density, robustness, energy efficiency and compactness of telecommunication, avionics, satellite, defense, energy and transport systems.
Researchers will also develop a new generation of cost-effective, compact, ultra-sensitive, highly-selective gas sensors for use in security, industrial process control, and environmental monitoring. And, finally, they will work on thermal and near-infrared imagery for security and defense applications. The lab will develop new types of detectors with increased resolution while reducing overall cost and speeding their adoption in the industrial-quality control, transportation and environmental markets, partners noted.
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