Leti Innovation Days detail Europe chip strengths

Leti Innovation Days detail Europe chip strengths

Feature articles |
By Nick Flaherty

The heart of the Leti Innovation Days for 2024 was undoubtedly the launch of the €830m pilot line for the next generation of low power 5G and 6G RF and system chips using FD-SOI technology.

One of four lines across Europe, eeNews Europe at event talked to Leti CEO Sébastien Dauvé and CTO Jean-René Lèquepeys about the details and covers some of the equipment that is already going in such as the latest ASML immersion lithography systems and plans for EUV for 7nm FD=SOI process technology..

But the event also brings together leading technologists from across Europe and the rest of the world who work with the French research institute. This ranges from a portable CT x-ray scanner developed with Thales to the latest optical interconnect for the Cerebras AI supercomputer on a wafer as well as the latest heterogeneous chiplet technologies. This is changing the way systems are developed, all the way back to the EDA tools.

At the same time, long term partner STMicroelectronics details a fundamental change to the way the company is structured to meet the challenges of the AI age, from the chip design and IP to the manufacturing and packaging.  

The event also showcased some of the new technologies being developed at the labs, from cyber-secure systems that can detect side channel attacks from lasers, to ways to coordinate the output of solar panels to eliminate the need for an inverters, as well as work with four quantum computing companies in France.



If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :    eeNews on Google News


Linked Articles