
Lattice Semiconductor has added two small FPGA devices built on a low power FD-SOI process and optimised for logic applications.
The Certus-NX-28 and Certus-NX-09 from Lattice have multiple FPGA package options for the 28,000 logic cells and 1054Kbits of embedded memory and 9000 cell densities with 270Kbits. The FPGA devices are aimed at communications, telecoms and industrial applications as well as automotive.
The fully depleted silicon on insulator (FD SOI) process gives a 4x reduction in power consumption for battery power applications with a 1.0V core voltage. This also allows simpler thermal management to reduce the size. The devices are packaged in a 6 x 6mm cfsBGA121 with 77 I/Os on a tighter 0.5mm pitch for the 09 and 81 for the 28, which also has a single hard IP interface for PCIe 2.0.
“Lattice is committed to delivering continued innovation in small, low power FPGAs to empower our customers with optimized solutions for space-constrained applications ranging from sensor interfacing to co-processing to low power AI,” said Dan Mansur, Corporate Vice President, Product Marketing, Lattice Semiconductor. “We’re excited to expand our Nexus-based small FPGA offerings by adding more migratable logic and package options including 0.8 mm pitch, ideal for Industrial applications.”
“We are happy to see Lattice introduce new Certus-NX devices offering more low power, small footprint and migration options to the Industrial applications requiring high reliability,” said Alberto Martin-Consuegra, VP Operations & Quality, ABB Process Automation.
“With the new Lattice Certus-NX devices, we are able to optimize the right memory / LUT footprint, low power density, small packages, and migration options required for our sensors,” said Reinhard Heizmann, Head of Distance Sensors R&D, Sensing Efficiency at SICK in Germany.
The new Certus-NX FPGA devices are shipping today and are supported by the latest release of Lattice Radiant design software.
