Looking beyond TSVs for 3D ICs
The 2016 SEMI European 3D Summit will include a wide scope of 3D integrated circuit topics beyond Through-Silicon-Via (TSV) technology ─ with talks on FO-WLP/ e-WLB, Embedded Die, and 3D alternative technologies.
Keynote and invited speakers will present their approaches and strategies for 3D Integration technologies, with specific attention on current adoption for applications such as memory, mobile, automobiles, wearables and more.
The increasing implementation of 3D technology in microelectronics devices has reshaped the electronics market. SEMI will highlight the latest business challenges and opportunities with a market briefing where 3D and packaging industry experts will present business and market insights.
Up to 30 companies working in the 3D sector will have the opportunity to exhibit their technologies at the 3D Summit exhibition.
SEMI will provide attendees networking opportunities throughout the event, including lunches, coffee breaks, a gala dinner and a complimentary one-on-one business meeting service.
New this year: SEMI will offer attendees a chance to visit the Minatec Showroom, to learn about the latest innovations being developed in the Grenoble tech hub.
The European 3D Summit steering committee includes executives from: ams AG, BESI, CEA-Leti, Evatech, EV Group, Fraunhofer-IZM, imec, Scint-X, SPTS, STMicroelectronics and SUSS Microtec.
The SEMI European 3D Summit consistently produces a large industry turnout receiving high satisfaction rates (97% overall satisfaction rate, 2012-2015).
Register at www.semi.org/European3DSummit
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Monolithic 3D integration beats next node
Developing and strengthening 3D IC manufacture in Europe
Manufacturers’ top tips to cost-effective 3D IC production
3D IC ramp up: what can we learn from MEMS?
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