Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package

Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package

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By Nick Flaherty

The LDBL20 from STMicroelectronics measures 0.47mm x 0.47mm x 0.2mm in a bumpless chip-scale package. This  avoids the minimum I/O-area and height limitation imposed by the diameter of traditional flip-chip solder bumps, extending ST’s family of compact LDOs from a 2mm x 2mm DFN to a 0.69mm x 0.69mm CSP with 300mA output.

In addition to its size advantage, the input voltage can range from 1.5V to 5.5V, with 200mV typical dropout. Rejection (PSRR) of 80dB at 100Hz and 50dB at 100kHz simplifies filtering over a wide frequency range to provide a stable rail for low-power circuitry in battery-operated applications. Quiescent current of 20µA no-load, 100µA full-load, and 0.3µA in standby help maximize efficiency under all operating conditions.

A wide range of output voltages is available on request, from 0.8V up to 5.0V in 50mV increments. Designers can also take advantage of built-in features such as logic-controlled electronic shutdown, internal soft-start, and support for active output-voltage discharge if required.

An evaluation board for the LDBL20, STEVAL-ISB034V1, is also available, which assists design-in to a wide range of products such as fitness and blood-pressure monitors, glucose meters, hearing aids, wearable sensors, smart headphones, portable audio devices, smart plugs, smart watches, and smartcards.

The LDBL20 is in production now, priced from $0.25 for orders of 1,000 pieces.

For further information please visit the product information page at

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