TE Connectivity has launched a low force XMC connector that support data rate speeds up to 32+ Gbit/s for improved signal processing on embedded computing applications.
The Mezalok High-Speed Low-Force (HSLF) connector has ball grid array attachment for surface mount applications in mezzanine cards. It meets the legacy Mezalok high speed connector qualifications and uses a rugged dual point contact system. This has a 47 percent lower unmating force and 32 percent reduction in mating force.
The Mezalok HSLF XMC connectors meet the same rugged standards as VITA 47 and VITA 72 for aerospace, ground vehicle, marine and missile defence applications with a wide operating temperature range of 55°C to +125°C and excellent thermal stability over 2000 cycles with VITA 42.3 pinout.
“Technology changes rapidly and it’s always important for us to quickly adapt and solve for market needs. We know signal integrity strength is crucial for reliable high-speed signal transfer within the environments this type of connector is used,” said Jason Dorwart, product manager for TE’s Aerospace, Defense and Marine division. “We also designed this particular connector to be easier to remove from the board and are truly excited to continue on with our Mezalok connector legacy by introducing our low-force product offering.”
The Mezalok HSLF uses the reliable ball grid array printed circuit board surface mount. The 114-position connector is compliant to VITA 61 standards and additional positions at 60 and 320 are available with stack heights of 10,12,17 and 18 mm.
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