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Low inductance decoupling capacitor arrays target high-reliability military/aerospace applications

Low inductance decoupling capacitor arrays target high-reliability military/aerospace applications

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By eeNews Europe



Widely utilized in commercial and industrial five nines (99.999%) uptime applications, such as mainframe class CPUs and ultimate performance multichip modules and communications systems, LICA Series low inductance decoupling capacitor arrays tested to MIL-PRF-123 also provide high-reliability and low inductance advanced decoupling solutions for a variety of military and aerospace applications, including high-pin-count FPGAs, ASICs, CPUs, and other high power, high performance ICs with low operating voltages.

Exhibiting <30pH ESL, which is currently the lowest ESL rating in the mil/aero market, AVX’s LICA Series includes several low inductance design features. Utilizing up to four separate capacitor sections in a single ceramic case, LICA Series arrays feature low resistance platinum electrodes in a low aspect ratio pattern, double electrode pickup, and perpendicular current paths. The series claims to be the only product in the military/aerospace market to feature C4 solder ball terminations, which enable minimal interconnect inductance and complements flip-chip packaging technology.

LICA Series components qualified to MIL-PRF-123 are rated for 25 V and -55°C to 125°C, reach peak capacitance at 55°C, and measure 1.85 mm x 1.6 mm x one of four height options: 0.65 mm, 0.875 mm, 1.10 mm, and 1.60 mm.

Typical lead time for the LICA Series is approximately 12-14 weeks.  

More information about the LICA Series of low inductance decoupling capacitor arrays at https://avx.com/docs/Catalogs/licarray.pdf

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