Low profile cabling sits under AI cooling system
Samtec has developed a low profile cable assembly that can sit underneath the cooling system of high power AI chips.
The 4.35 mm mated height of Si-Fly LP cable-to-board assemblies allow side-to-side, front-to-back or belly-to-belly PCB mounting near the IC package, with secure placement under heat sinks or other cooling hardware where z-axis height is limited.
Signal reach and integrity become increasingly important in high-speed Data Center, HPC and AI applications where Si-Fly LP is commonly deployed. Each design is unique, so Samtec works with system architects early in the process to create solutions for cable management and thermal load distribution.
Each Si-Fly LP cable assembly provides 112 Gbps PAM4 channel rate in a 2-row, 16-pair design with aggregate data rates of 896 Gbit/s (x8 bi-directional) or 1.79 Tbit/s (x16 uni-directional) and is PCIe 6.0/CXL 3.2 capable. Routing signals from the chip through high-density, high-performance Flyover cable reduces thermal challenges, simplifies board layout and improves overall cost by eliminating expensive re-timers and allowing for fewer board layers and less expensive printed circuit board materials.
Si-Fly LP cable assemblies feature Samtec’s proprietary 34 AWG, 92 Ohm ultra-low-skew Eye Speed twinax cable. Eye Speed twinax improves signal integrity performance using co-extrusion techniques that optimize symmetry between signal conductors and shielding, achieving extremely low intrapair skew.
The Si-Fly LP cable systems (CPC, CPI) are in stock from Samtec.
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