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Low thermal expansion epoxy passes NASA low outgassing tests

Low thermal expansion epoxy passes NASA low outgassing tests

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By eeNews Europe



This two component epoxy combines outstanding performance with a very low thermal expansion coefficient, a significant breakthrough from the high thermal expansion that is typical of most epoxy compounds. Serviceable over the wide temperature range of -60 to 250ºC, EP30LTE-LO cures at room temperature with 85% of its maximum strength developed within 48 hours.

Faster cures are possible at elevated temperatures. This 100% reactive epoxy features an exceptionally low coefficient of thermal expansion of 12×10-6 in/in/º and a low shrinkage rate of less than 0.0002 in/in. It bonds well to metals, glass, ceramics, wood, vulcanized rubbers and most plastics, and produces bonds with a tensile strength over 5,000 psi.

This electrically insulative system resists thermal cycling and chemicals including water, fuels, and many acids, bases, salts and organic solvents. It has a long working life of up to 60 minutes for a 200 gram mass. EP30LTE-LO has a 10 to 1 mix ratio by weight and can be easily applied with a spatula, knife, trowel, brush or paint roller. It can also be readily cast as thick as 1 inch without undue exotherm developing. EP30LTE-LO is available in half-pint, pint, quart, gallon and 5 gallon container kits.

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