
‘Lowest power’ Bluetooth LE module hosts Toshiba SoC
New Products
|
By
eeNews Europe
The 15.6 x 8.7 x 1.9 mm SMD module is based on Toshiba’s single chip TC35678 Bluetooth semiconductor device with embedded Toshiba Bluetooth 4.2 LE stack and embedded flash for user applications in stand-alone operation. The PAN1760A product can either be operated in AT-Command or Host mode for simple integration of Bluetooth connectivity into existing products, or in Stand-Alone mode. In Stand-Alone mode, with 256 kB flash memory and 83 kB RAM for user application, the PAN1760A can be used for many applications without the need for an external processor. The PAN1760A module is currently awaiting FCC, IC, and CE approval.
Panasonic; https://eu.industrial.panasonic.com/download/pan1760a-bluetooth-low-energy-module
