LPDDR5X DRAM packages for on-device AI in mass production
Samsung Electronics has announced it has begun mass production for the industry’s thinnest 12 nm-class, 12GB and 16GB LPDDR5X DRAM packages, solidifying its leadership in the low-power DRAM market.
Leveraging its extensive expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical especially for high-performance applications with advanced features such as on-device AI.
“Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package,” said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics.
With the new LPDDR5X DRAM packages, Samsung offers the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure, reducing the thickness by approximately 9% and improving heat resistance by about 21.2%, compared to the previous generation product.
By optimizing printed circuit board (PCB) and epoxy molding compound (EMC) techniques, the new LPDDR DRAM package is as thin as a fingernail at 0.65 mm, the thinnest among existing LPDDR DRAM of 12GB or above. Samsung’s optimized back-lapping process is also used to minimize the package height.
Samsung plans to continue expanding the low-power DRAM market by supplying its 0.65 mm LPDDR5X DRAM to mobile processor makers as well as mobile device manufacturers. As demand for high-performance, high-density mobile memory in smaller package sizes continues to grow, the company plans to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future devices.
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