Major improvement in 200 mm RF MEMS switch manufacturing process
Contact reliability has been improved by replacing the gold-based contacts that exhibited poor reliability and high sensitivity to stiction with better-performing ruthenium-based contacts. A hermetic thin-film packaging process also has been developed to prevent organic contamination and to maintain low contact resistance. The new switch-manufacturing process has been demonstrated on 200mm silicon wafers at the MINATEC dedicated MEMS fabrication platform. Yields close to industrial standards have been achieved, providing thousands of working devices per wafer.
The RF MEMS switches offer numerous opportunities to increase the functionality and re-configurability of microwave telecommunication systems. Leti’s industrial partners are currently evaluating samples of these switches for use in efficient reflect-array antennas and redundancy switching matrices.
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