MCU/LIN transceiver combo addresses space, cost constraints
Produced on Infineon’s automotive qualified 130nm Smart Power technology, the new SoCs offer a very high level of integration. The VQFN-48 packages have a 7mm x 7mm footprint, which is about 50 percent less compared to the predecessor devices. Compared to the previous generation TLE78xx multi-chip module devices, the single-chip TLE983x devices provide an increased CPU performance and Flash memory capacity, higher number of high voltage monitor inputs, smaller footprint and further cost reductions.
“With the new ePower generation Infineon introduces a system-on-chip semiconductor solution that integrates all functions required to sense, control and actuate a motor for space and cost critical automotive body applications,” said Andreas Doll, Vice President and General Manager, Body Power of the Automotive division at Infineon Technologies AG. “Automotive designers benefit from an increased design flexibility with reduced board space, reduced circuit complexity, low power consumption and lower bill of material.”
The TLE983x integrates all necessary functionality for relay drive motor control applications. The 8-bit microcontroller (MCU), derived from Infineon existing XC800, achieves up to 10 Whetstone MIPS at 40MHz, which is comparable to the processing power of 16-bit microcontrollers. This is combined with LIN transceiver, voltage regulator and both low-side and high-side drivers on one single chip. Other features include 4kB EEPROM emulation, on-chip 2-wire debug interface, 10-bit AD converter with five channels, up to five high-voltage wake-up inputs and a PWM unit for external motor control. In addition, a measurement interface for monitoring battery voltage and chip temperature is integrated. Low power modes enable a sleep mode current down to 25µA, while the wake-up from the low power mode is possible via a LIN bus message or the wake-up inputs.
The integrated LIN transceiver is compliant with the LIN standards 2.0, 2.1 and SAE J2602, ensuring worldwide usage. The high level of integration is based on a new automotive qualified (AEC) Smart Power technology, using – as an industry first – a 130nm process technology. The TLE983x family offers scalability in terms of Flash memory sizes (36kB to 64kB) with pin and software compatible devices.
Engineering samples of the new devices are available in VQFN-48 packages operating with a wide voltage range from 3.0V to 27V (40V max.). The family members include devices with 36kB, 48kB and 64kB flash and integrated OpAmp and PN MOSFET driver. The TLE983x family is supported by Infineon and third party vendors with a complete development tool chain including evaluation board, IDE, compiler, debugger and Infineon’s free development environment DAVE (Digital Application Virtual Engineer) for automatic code generation.
Further information is available www.infineon.com/automotive.
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