mCube takes tri-axis accelerometer to 1.1mm
The 14-bit, 3-axis MC3571 accelerometer is built upon the company’s 3D monolithic single-chip MEMS technology platform which combines MEMS and CMOS using through-silicon vias (TSVs) to minimize or eliminate the use of wirebonds. It has the same spec as mCubes previous 2mm by 2mm three-axis accelerometer but occupies one quarter of the volume.
Some 100 million units of mCube’s earlier accelerometers have shipped in mobile phones to date, the company said.
The MC3571 makes use of wafer-level chip-scale packaging (WLCSP) developed by partner ASE Group and its small size is said to open up design possibilities in thin mobile phones and medical devices.
MC3571 is a digital output 3-axis accelerometer, which features the following:
8, 10, or 14-bit resolution;
Output Data Rates (ODR) up to 1024Hz;
Selectable interrupt modes via an I2C bus;
Samples of the world’s smallest 1.1×1.1mm WLCSP accelerometer are available to select lead customers now with volume production scheduled for the second quarter of 2016.
WLCSP provides a path towards chip-onboard packaging which could potentially offer lower cost. Source: mCube.
"mCube is the first company we’ve seen with a 1.1mm by 1.1mm integrated MEMS and CMOS accelerometer and stretches once again the limits of miniaturization establishing new standards for the industry," said Guillaume Girardin, MEMS analyst at Yole Developpement, in a statement from mCube.
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