MediaTek 5G SoC targets mass market 5G smartphones
MediaTek has unveiled the Dimensity 700 5G smartphone chipset, a 7nm 5G SoC designed to bring advanced 5G capabilities and experiences to the mass market. The addition of this 7nm SoC to the Dimensity family of 5G chips gives device makers a full suite of options for 5G smartphone models – from flagship and premium to mid-range and mass market devices – making 5G more accessible for consumers everywhere.
The Dimensity 700 packs advanced connectivity features including 5G Carrier Aggregation (2CC 5G-CA) and 5G dual SIM dual standby (DSDS), giving users access to the fastest speeds and 5G-exclusive Voice over New Radio (VoNR) services from either connection. On the processing power side, the chip integrates two Arm Cortex-A76 big cores in its octa-core CPU and operates at up to 2.2 GHz.
“With our expanded Dimensity portfolio we’re bringing the latest 5G capabilities to every smartphone tier so more people can enjoy 5G experiences,” said Dr. JC Hsu, Corporate VP and GM of MediaTek’s Wireless Communications Business Unit. “The Dimensity 700 has an impressive mix of 5G connectivity features, advanced camera capabilities like night shot enhancements and multiple voice assistant support, all in a super power-efficient design.”
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The 5G SoC features MediaTek 5G UltraSave, which delivers advanced power-saving technologies to improve battery life. It includes UltraSave Network Environment Detection, MediaTek 5G UltraSave OTA Content Awareness, Dynamic BWP and Connected Mode DRX. The built-in technology intelligently manages a device’s 5G connection so you can do more and charge your device less often.
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Support for premium 90 Hz display enables brands to design smartphones with crisp, high resolution FullHD+ displays and ultra-fast refresh rates to reduce blur in animations, scrolling and games for the best user experience.
The 5G SoC supports 48MP or 64MP main camera sensors with AI-bokeh, AI-color and AI-beauty features. Plus, the integrated hardware-based imaging accelerators enable multi-frame noise reduction so users can capture high quality shots with low noise, even at night.
The Dimensity 700 also supports voice assistants from global brands such as Alibaba, Amazon, Baidu, Google and Tencent to give device makers more configuration options.
According to David McQueen, Research Director at tech market advisory firm, ABI Research: “The latest 5G smartphone chipset announced by MediaTek confirms the company’s aggressive strategy to bring high performance and cutting-edge innovative features to mid-range smartphones.
“Offering the most advanced connectivity features including 5G Carrier Aggregation (2CC 5G-CA) and 5G dual SIM dual standby (DSDS), as well as voice and video calling over NR, and almost 3Gbps DL speed, the Dimensity 700 chipset brings support for capabilities that have mainly been the preserve of high-end smartphones. By also supporting camera AI and high-quality displays, the chipset brings to market an impressive array of high-end features to mass-market phones, which will help to quickly democratize the 5G experience across price tiers.”
“The Dimensity 700 is expected to be found in commercial device deployments by the end of 2021, if not sooner, owing to the rapid rate that leading OEMs are expected to push deeper into the lower-priced 5G smartphone segment, which will be the main growth driver for accelerating adoption in 2021 and beyond.”
https://i.mediatek.com/mediatek-5g
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