MEMS move to 300mm-diameter wafers

MEMS move to 300mm-diameter wafers

Technology News |
By eeNews Europe

This is reckoned to be the first example of 300mm wafer MEMS production and although CEA-Leti is not a commercial organization illustrates the direction that the MEMS sector will one day take to save cost.

The wafer was presented by Jean-René Lèquepeys, head of Leti’s silicon components division, at the European MEMS Summit taking place in Milan, Italy, Sept. 17-18.

CEA-Leti used its piezo-resistive silicon nanowire technology, which allows the fabrication of three-axis accelerometer, three-axis gyroscope, three-axis magnetometer and pressure sensor on the same chip. The technology is currently being transferred to Tronics Microsystems SA (Grenoble, France), which currently only manufactures on 200mm wafers. CEA-Leti described the demonstration of the technology on 300mm-diameter wafers as showing "very promising results."

The compatibility of Leti’s 200mm-developed technologies with 300mm wafer fabribation, "shows a significant opportunity to cut MEMS production costs," said Leti CEO Marie Semeria. “This will be especially important with the worldwide expansion of the Internet of Things and continued growing demand for MEMS in mobile devices.”

In addition to lowering costs, manufacturing MEMS with 300mm technology enables 3D integration using MEMS CMOS processes in more advanced nodes than on 200mm, and the use of 3D through-silicon-vias (TSV), which is already available in 300mm technology.

When asked at the European MEMS Summit when TSMC would be moving to 300mm-diameter wafer production Kees Joosse, director for business development in Europe, said: "Not any time soon."

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