MEMS summit heads to Stuttgart
While the first annual event was held in 2015 in Milan, close to the manufacturing base of STMicroelectronics, the second will come to Stuttgart and close to the home of Bosch Sensortec, the market leader in the sale of MEMS components.
The Summit will provide a combination of executive talks, exhibition and networking to help address some of the issues that face the MEMS sector.
Major issues up for discussion include:
Making sensors smaller, smarter, and cheaper
Emerging technologies and their readiness, maturity
Price and margin pressures and business models
Market dynamics and new opportunities
Sessions are also being crafted on automotive, consumer electronics and wearables and the Internet of Things (IoT).
The conference program is developed by a steering committee composed of executives from ASE, Bosch, Bosch Sensortec, CEA-Leti, EV Group, Fraunhofer ENAS, Fraunhofer IZM, IHS, NXP, Okmetic, Sencio, SPTS, STMicroelectronics, SUSS MicroTec, X-Fab, and Yole Developpement. The program is due to be announced in late spring.
SEMI is operating a system of “early-bird” registration that is open until May 31.
Related links and articles:
www.semi.org/europeanMEMSSummit
News articles:
Panel ponders MEMS roadmaps, a Moore’s Law of MEMS
MEMS sector faces a fight to provide value
Not enough money in MEMS, own the data, says InvenSense CEO
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