MENU

MEMS supply chain players back 2-year design contest

MEMS supply chain players back 2-year design contest

Market news |
By Graham Prophet



Jointly sponsored by Cadence Design Systems, Coventor, X-FAB and Reutlingen University, a new MEMS Design Contest was launched at the DATE 2016 conference. The objective of the contest is to encourage greater ingenuity with regard to the integration of MEMS devices and mixed-signal CMOS blocks.

 

The contest seeks companies, entrepreneurs, researchers and students from around the world. Design teams are encouraged to propose imaginative design concepts that combine MEMS and mixed-signal technologies. The organisers will provide free training workshops to familiarise the participating teams with the design tools, design methodologies and process technologies involved.

 

A panel of industry professionals and academics will undertake appraisal of the submissions. Each submission will be judged on the degree of innovation demonstrated in hardware and methodology, the novelty of the application and the value the design provides. Awards for the top three submissions will be presented at Cadence’s annual user conference, CDNLive EMEA 2018, in Munich and the winning team’s solution will be manufactured at X-FAB’s wafer production facilities.

 

For complete information on the contest and how to enter visit: www.cadence.com/MEMS_Design_Contest_2018

 

Next page; information on contest sponsors, and quotes…


“Supporting innovation and advancement in electronic design is fundamental to what this contest is all about,” said Alexander Duesener, Corporate VP EMEA of Cadence Design Systems. “Creating mixed-signal logic and MEMS designs requires a new process flow and totally new thinking. By enabling the winning design team to turn their concepts into manufactured designs, we highlight the value of MEMS and mixed-signal designs in today’s products.”

 

“The MEMS Design Contest calls attention to the increasing integration of MEMS and mixed-signal technologies in phones, cars and Internet of Things (IoT) devices,” said Dr. Stephen Breit, Vice President of Engineering at Coventor. “By offering design teams state-of-the-art Cadence and Coventor tools in combination with X-FAB’s latest MEMS and CMOS design kits, we hope to inspire new applications of our combined solution for efficiently designing, integrating and manufacturing MEMS and mixed-signal CMOS technologies.”

 

“By enabling the winning design team to turn their ideas into manufactured designs, X-FAB is highlighting the value of proven MEMS process technology and design enablement through our design kits,” added Joerg Doblaski, Director Design Support at X-FAB. “We look forward to seeing innovative designs from around the world and helping bring the best of them to life.”

 

 

Reutlingen University (www.reutlingen-university.de) is one of Germany’s leading universities, offering international academic programs with close ties to industry and commerce. It will help formulate and organise the call for participation of the contest.

 

X-FAB (www.xfab.com) is an analogue/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. X-FAB’s analogue-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at five production facilities in Germany, Malaysia and the U.S.

 

Coventor, Inc. (www.coventor.com/mems-solutions) specialises in automated design solutions for developing semiconductor process technology and micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organisations from its headquarters in Cary, North Carolina, and offices in Silicon Valley, California, Waltham, Massachusetts, and Paris, France.

 

Cadence (www.cadence.com) provides software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centres and research facilities around the world.

 

 

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :    eeNews on Google News

Share:

Linked Articles
10s