MGM210x and BGM210x Series 2 modules support Zigbee, Thread, Bluetooth mesh, Bluetooth Low Energy and multiprotocol connectivity. The xGM210x modules are pre-certified for North America, Europe, Korea and Japan, minimizing the time, cost and risk factors when designing a product for global wireless certifications.
The modules are based on Silicon Labs’ Wireless Gecko Series 2 platform. The platform offers industry-leading RF performance, an Arm Cortex-M33 processor, best-in-class software stacks, a dedicated security core and up to +125oC operating temperatures. They also feature an integrated RF power amplifier.
There and two initial families in the Series 2 module portfolio. The first is optimised for LED light bulbs and the second is a versatile PCB form-factor module for a broad range of miniature IoT designs.
xGM210L modules feature a custom form factor for mounting inside LED bulb housings, PCB trace antenna to maximise wireless range, high temperature ratings, extensive global regulatory certifications and low active power consumption.
xGM210P modules come in a PCB form factor and offer an integrated chip antenna and minimal clearance areas for mechanics.
For security, xGM210x modules provide secure boot with root of trust and secure loader (RTSL) technology helps prevent malware injection and rollback for authentic firmware execution and OTA updates. A dedicated security core is available to isolate the application processor and deliver quick, cryptographic operations with differential power analysis (DPA) countermeasures. It also has a true random number generator (TRNG) that is compliant to NIST SP800-90 and AIS-31. A secure debug interface with lock/unlock allows authenticated access for enhanced failure analysis. The module’s Arm Cortex-M33 core integrates TrustZone technology.
Silicon Labs’ Simplicity Studio IDE has comprehensive software stacks, application demos and mobile apps to speed up development. A network analyzer and energy profiler help optimise wireless performance and energy consumption.