Mesh networking modules streamline secure IoT product design

Mesh networking modules streamline secure IoT product design

New Products |
By Rich Pell

The MGM210x and BGM210x Series 2 modules support leading mesh protocols ((Zigbee, Thread and Bluetooth mesh)), Bluetooth Low Energy, and multiprotocol connectivity. Pre-certified for North America, Europe, Korea and Japan, the modules are offered as providing a one-stop wireless solution to improve mesh network performance for line-powered IoT systems ranging from smart LED lighting to home and industrial automation.

“This new portfolio of application-optimized modules provides a fast and easy wireless on-ramp to mesh networking, helping IoT developers get their connected products to market ahead of the competition while preserving their investments in tools and software,” says Matt Saunders, Vice President of Marketing and Applications, IoT Products, Silicon Labs. “Our fully integrated module design, comprehensive wireless stacks, state-of-the-art security and powerful development tools help our customers add wireless connectivity and mesh capabilities to IoT applications with the lowest R&D investment, saving months of engineering effort and testing.”

The modules are based on the company’s Wireless Gecko Series 2 platform featuring industry-leading RF performance, an Arm Cortex-M33 processor, best-in-class software stacks, a dedicated security core, and a +125°C temperature rating suited for harsh environmental conditions. The modules, says the company, are engineered to optimize the performance of resource-constrained IoT products without requiring functionality trade-offs impacting communication reliability, product security or field upgradability.

An integrated RF power amplifier also makes the modules ideal for long-range Bluetooth Low Energy applications requiring hundreds of meters of line-of-sight connectivity. The Series 2 module portfolio’s initial families include the industry’s first pre-certified wireless modules optimized for LED light bulbs and a versatile printed-circuit board (PCB) form-factor module designed to meet the needs of a broad range of ultra-small IoT product designs.

Samples and production quantities of the xGM210P modules are available now. Samples and production quantities of the xGM210L modules are planned to be available in Q4 2019. The Wireless Gecko starter kit mainboard and Series 2 radio boards are also available now.

Silicon Labs

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