Micro-Qseven format puts Freescale i.MX 6 processors in smaller COM

Micro-Qseven format puts Freescale i.MX 6 processors in smaller COM

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By eeNews Europe

The format is, says congatec (Deggendorf, Germany), an extension to its product portfolio for the most popular Qseven standard that places Computer-on-Modules in the 40 x 70 mm sub-credit-card µQseven format. The first module in this mini form factor is the conga-UMX6 with ARM Cortex A9-based Freescale i.MX 6 processors. It caters to applications in harsh environments, which require not only compact low-power designs, but also multimedia and computing performance. conga-UMX6 µQseven computer modules will offer ARM-consistent, long-term availability of 10+ years, high performance-per-Watt with a typical power consumption of 3.5W, plus the extended temperature support of -40°C to +85°C.

Users of the µQseven computer modules will, the company claims, benefit from the high level of standardisation and scalability of this form factor, which enables very small and flat designs. congatec’s documentation, driver implementations and integration support help OEMs to integrate this processor technology very quickly and efficiently into their individual applications. Users already deploying Qseven designs can immediately test these µQseven modules, thanks to their pin compatibility with Qseven modules.

The modules from are equipped with ARM Cortex A9-based Freescale i.MX 6 SoCs, which offer a long-term availability of at least 10 years and range from 1 GHz single- to dual-core performance plus up to 1 Gigabyte of soldered memory. With OpenGL ES 1.1/2.0/3.0 and OpenVG 1.1, the integrated high performance graphics support 2D and 3D applications with up to WUXGA resolutions (1920 x 1200). Hardware-accelerated video processing allows the modules to decode 1080p videos at 60 Hz in real time and encode up to two 720p videos. Two independent displays get connection via 2x LVDS or alternatively via 1x LVDS and 1x HDMI 1.4. The support of the I²S bus ensures jitter-free, high-quality audio transmission. For application and data storage, the module has 1x SATA and an optional 32 GB SSD.

To connect application-specific I/Os, the modules provide 1x PCI Express 2.0, 5x USB 2.0, 1x Gbit Ethernet and 1x CAN Bus to the carrier board. The module integrated board management controller offers – amongst other things – watchdog timer and power loss control, as well as support of monitoring, management and maintenance features for distributed IoT installations. Board Support Packages (BSPs) are available for Android and all common Linux distributions as well as Windows Embedded Compact 7. All BSPs are fully released and available for download at congatec’s GIT-server.



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