Micron breaks ground on US$2.75 billion Indian chip packaging fab
Memory chip company Micron Technology Inc. (Boise, Idaho) has broken ground on a chip assembly and test facility in Sanand, Gujarat, India, that is set to cost US2.75 billion, according to local reports.
However, Micron is set to pay only 30 percent of the cost – or about US$825 million – with a 70 percent subsidy coming from the Indian federal and state authorities.
The company confirmed the plan to build a DRAM and NAND assembly, test, marking and packaging facility in Gujurat when President Modi of India was visiting with US President Biden in June (see India will pay for 70 percent of Micron’s US$2.75 billion packaging plant). The facility will take DRAM and NAND wafers in and produce ball grid array (BGA) ICs, memory modules and solid-state drives and could begin operations as soon as December 2024 although other estimates say within 18 months which would put the start at 1Q25.
The ATMP unit, will be built on 93 acres of land at the Sanand GIDC-II industrial estate on behalf of Micron by Tata Projects, a conglomerate that has its own interest in chip packaging and wafer fabs (see Tata cleared to create chip packaging plant: report and Tata ready to buy its way into semiconductors: report). The factory is due to be constructed in two phases that will create about 5,000 direct jobs and 15,000 jobs in the community.
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News articles:
Indian chip maker to expand IC packaging capacity
Tata cleared to create chip packaging plant: report
Tata ready to buy its way into semiconductors: report
India will pay for 70 percent of Micron’s $2.75 billion packaging plant
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