Mini dual-inline-package intelligent power modules target industrial applications
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eeNews Europe
The modules feature embedded bootstrap diode (BSD) chips, embedded analog temperature voltage output (VOT) and a 5 to 50A current rating. The Mini DIPIPM series uses sixth-generation IGBT chips featuring the carrier-stored trench-gate bipolar transistor (CSTBT) structure, a special feature of Mitsubishi Electric IGBT chips, as well as integrated external components such as BSD, current-limiting resistors and thermistors, to reduce the power consumption, size and cost of small-capacity inverter systems. The 31.0×52.5×5.6mm unit reduces losses a further 10% compared to Mitsubishi Electric’s existing DIPIPM Ver.3 series. The Mini DIPIPM Series is compliant with the European RoHS.
Visit Mitsubishi Electric at www.mitsubishielectric.com
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