Mini pinout for COM-HPC standard

Mini pinout for COM-HPC standard

Technology News |
By Nick Flaherty

The PICMG standards group has agreed a pinout for a smaller version of the COM-HPC high performance computer on module.

The COM-HPC Mini measures 60 x 95 mm for embedded processors in devices such as top-hat rail PCs for control cabinets in building and industrial automation, or portable test and measurement devices. The standard uses computer modules to be mounted on a carrier board, allowing the modules to be easily upgraded to provide more performance over time.

The pinout specification defines the use of one connector instead of the two implemented for the larger COM-HPC Client and Server modules (Sizes A -E) in a similar way to COM Express Mini compared to COM Express Type 6.

While this is half the number of signal pins, it still provides 400 signal lanes, 90% of the capacity of COM Express Type 6 modules. COM-HPC Mini is also 50% smaller than COM-HPC Client Size A modules, the currently smallest available COM-HPC form factor.

The new specification will enable engineers to integrate state-of-the-art computer interface technologies such as PCIe Gen4 and Gen5 into small boards with high performance. As a result this is expected to become the high-end standard on top of the COM Express Mini standard.

The COM-HPC Mini working group was sponsored by congatec, Kontron and Adlink,  and the 15 member companies developed the standard in 12 weeks from the approved Statement of Work and the final definition of the mechanics and pinout.

“The definition of COM-HPC Mini is happening almost at the speed of light,” said Christian Eder, Chairman of the COM-HPC technical committee and Director Product Marketing at congatec in Germany. “If the working group maintains this performance, and I see no reason to slow it down as there are no significant technical challenges left to address, I am confident to have a release candidate available for the PICMG release process in Q1 2023, and a published specification by Q2 2023. I anticipate first product announcements will be closely tied to the publication date,” he said.

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