Miniaturized leadless logic saves space
Nexperia has introduced a new series of 64 miniature logic ICs in automotive-qualified MicroPak XSON5 leadless packaging.
The AECq-100 devices are used in space constrained automotive applications such as chassis safety systems, battery monitoring, infotainment units, and advanced driver assistance systems (ADAS).
MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB footprint than traditional leaded mini logic packages, that also features side-wettable flanks to support automated optical inspection (AOI) of solder joints.
Leadless packaging with side-wettable flanks improves manufacturing reliability by allowing the use of AOI techniques to examine the quality of solder joints. This boosts board production while reducing costs and still meeting the strict criteria of perfectly soldered joints.
Nexperia’s SOT8065-1 MicroPak XSON5 has 5 terminals and measures 1.1mm × 0.85mm × 0.47mm. It is free from delamination and offers highest immunity to moisture MSL-1. Uniform 7 μm Sn layer on pad sides and bottom to prevent oxidation and is RoHS and dark green compliant. SOT8065-1 devices use the same die as in the SOT353 package but offers a smaller PCB footprint with superior solder durability and enhanced electrical performance.
www.nexperia.com/packages/SOT8065-1.html
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